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Hot Melt Adhesive Based On Low Melting Point Polypropylene Homopolymers - EP2999760

The patent EP2999760 was granted to Bostik on Apr 13, 2022. The application was originally filed on May 21, 2014 under application number EP14734311A. The patent is currently recorded with a legal status of "Revoked".

EP2999760

BOSTIK
Application Number
EP14734311A
Filing Date
May 21, 2014
Status
Revoked
May 16, 2025
Grant Date
Apr 13, 2022
External Links
Slate, Register, Google Patents

Patent Summary

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HENKELJan 13, 2023-ADMISSIBLE

Patent Citations (17) New

Patent citations refer to prior patents cited during different phases such as opposition or international search.

Citation PhasePublication NumberPublication Link
DESCRIPTIONUS6747114
DESCRIPTIONUS6797774
DESCRIPTIONUS7517579
DESCRIPTIONUS7524911
DESCRIPTIONUS7776242
EXAMINATIONUS2011021103
EXAMINATIONWO2016006353
INTERNATIONAL-SEARCH-REPORTEP1498432
INTERNATIONAL-SEARCH-REPORTWO2013019507
INTERNATIONAL-SEARCH-REPORTWO2013039261
INTERNATIONAL-SEARCH-REPORTWO2013039262
OPPOSITIONUS2013071654
OPPOSITIONWO2007022372
OPPOSITIONWO2011053406
OPPOSITIONWO2012088384
OPPOSITIONWO2013039261
OPPOSITIONWO2013039262

Non-Patent Literature (NPL) Citations (1) New

NPL citations refer to non-patent references such as research papers, articles, or other publications cited during examination or opposition phases.

Citation PhaseReference TextLink
OPPOSITION- Anonymous, "Report of DSC analysis of a sample of Licocene PP MA6252", DSC, (20120901), page 1, XP093017113-

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Dossier Documents

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