Hot-Melt Adhesive Composition For Forming A Film Capable Of Enclosing A Hot-Melt Adhesive, And Use Thereof

Patent No. EP2610320 (titled "Hot-Melt Adhesive Composition For Forming A Film Capable Of Enclosing A Hot-Melt Adhesive, And Use Thereof") was filed by Bostik on Dec 21, 2012. The application was issued on Oct 29, 2014.

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HENKELJul 29, 2015-

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EP2610320

BOSTIK
Application Number
EP12198858A
Filing Date
Dec 21, 2012
Status
Revoked
Publication Date
Oct 29, 2014