Extrudable Hot-Melt Pressure-Sensitive Adhesives For Resealable Packaging Having Improved Organoleptic Properties

Patent No. EP2966140 (titled "Extrudable Hot-Melt Pressure-Sensitive Adhesives For Resealable Packaging Having Improved Organoleptic Properties") was filed by Bostik on Jun 29, 2015. The application was issued on May 10, 2017.

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LEHMANN&VOSS&Feb 12, 2018UEXKULL & STOLBERG

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EP2966140

BOSTIK
Application Number
EP15174317A
Filing Date
Jun 29, 2015
Status
Opposition Rejected
May 19, 2023
Publication Date
May 10, 2017