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Metallocene Polyolefin Based Low Activation Temperature Heat Seal Hot Melt Adhesive

Patent No. EP3247758 (titled "Metallocene Polyolefin Based Low Activation Temperature Heat Seal Hot Melt Adhesive") was filed by Bostik on Jan 22, 2016. The application was issued on Dec 25, 2019.

Patent Summary

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Patent Family

Patent Oppositions (2)

Patent oppositions filed by competitors challenge the validity of a granted patent. These oppositions are typically based on claims of prior art, lack of novelty, or non-obviousness. They are a key part of the process for determining a patent's strength and enforceability.

CompanyOpposition DateRepresentative
HENKELSep 24, 2020-
BOREALISSep 17, 2020KADOR & PARTNER PART MBB

Dossier Documents

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EP3247758

BOSTIK
Application Number
EP16703681A
Filing Date
Jan 22, 2016
Status
Opposition Rejected
Jan 10, 2025
Publication Date
Dec 25, 2019
External Links
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