Solder Alloy, Solder Ball, Solder Preform, Solder Paste And Solder Joint

Patent No. EP3715039 (titled "Solder Alloy, Solder Ball, Solder Preform, Solder Paste And Solder Joint") was filed by Senju Metal Industry on Mar 27, 2020. The application was issued on Aug 11, 2021.

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JG OPPOSITIONSMay 10, 2022BOULT WADE TENNANT

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EP3715039

SENJU METAL INDUSTRY
Application Number
EP20166279A
Filing Date
Mar 27, 2020
Status
Opposition Rejected
Mar 22, 2024
Publication Date
Aug 11, 2021