Thermally Conductive Curable Composition
Patent No. EP3924412 (titled "Thermally Conductive Curable Composition") was filed by Sika Technology on Feb 12, 2020. The application was issued on Dec 10, 2025.
Patent Summary
This moisture-curable composition is used to adhesively bond, coat, or seal substrates, where at least one substrate is a battery or electronic device. The composition comprises 0.6 to 15.0 wt.% of at least one organic polymer (P) containing reactive silane groups, 70 to 95 wt.% of at least one filler (F), and at least one dispersion additive (D). It may optionally include a curing catalyst and up to 10 wt.% of a plasticizer (PL). Filler F is selected from aluminium oxide, aluminium hydroxide, boron nitride, aluminium nitride, zinc oxide, silver, copper, aluminium, chalk, aluminosilicate, graphite, or mixtures thereof, provided chalk does not exceed 25 wt.% of the total filler content. The composition is designed for high thermal conductivity without interfering with e-coat processes.
Patent Family
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Dossier Documents
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Date
Description
EP3924412
- Application Number
- EP20704027A
- Filing Date
- Feb 12, 2020
- Status
- Granted And Under Opposition
- Nov 7, 2025
- Publication Date
- Dec 10, 2025
- External Links
- Slate, Register , Google Patents